51-9141.00 · Task explorer
Semiconductor Processing Technicians: reported tasks and exploration worksheet
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
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Read the task inventory
This source lists 17 tasks, including 8 marked Core and 9 marked Supplemental. Labels and dates are retained below. Employers can combine or divide these responsibilities differently; explore the task itself before assuming it belongs in every version of the role.
Task source dates: 08/2026.
17 tasks shown
Core · Task 12575 · 08/2026 · Incumbent
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Core · Task 12577 · 08/2026 · Incumbent
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Core · Task 12576 · 08/2026 · Incumbent
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Core · Task 12574 · 08/2026 · Incumbent
Maintain processing, production, and inspection information and reports.
Core · Task 12580 · 08/2026 · Incumbent
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Core · Task 12578 · 08/2026 · Incumbent
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Core · Task 12573 · 08/2026 · Incumbent
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Core · Task 12587 · 08/2026 · Incumbent
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Supplemental · Task 12589 · 08/2026 · Incumbent
Stamp, etch, or scribe identifying information on finished component according to specifications.
Supplemental · Task 12579 · 08/2026 · Incumbent
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Supplemental · Task 12584 · 08/2026 · Incumbent
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Supplemental · Task 12583 · 08/2026 · Incumbent
Load semiconductor material into furnace.
Supplemental · Task 12585 · 08/2026 · Incumbent
Count, sort, and weigh processed items.
Supplemental · Task 12591 · 08/2026 · Incumbent
Scribe or separate wafers into dice.
Supplemental · Task 12586 · 08/2026 · Incumbent
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Supplemental · Task 12582 · 08/2026 · Incumbent
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Supplemental · Task 12588 · 08/2026 · Incumbent
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
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Source and practice material
Occupational context uses the O*NET® 31.0 Database from the U.S. Department of Labor, Employment and Training Administration, under CC BY 4.0. View the occupation.
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